RELIFE RL-601T Middle Board Tinning Platform Kit – iPhone 16 Series

The RELIFE RL-601T Middle Board Tinning Platform Kit is a specialized mobile phone motherboard repair tool designed for middle-layer tinning, soldering, desoldering, and 3D BGA reballing. It helps technicians perform precise motherboard repairs and maintain accurate alignment during soldering operations.

Designed for professional smartphone repair applications, the kit features a high-temperature-resistant synthetic stone platform and a precision steel stencil with square and round openings. Its 0.12 mm steel stencil supports detailed tinning work while helping reduce solder ball jamming. This version is optimized for the iPhone 16 series, with the universal base supporting compatible modular configurations across additional iPhone generations.

Specifications

• Brand: RELIFE

• Model: RL-601T

• Product Type: Middle Board Tinning Platform Kit

• Application: Motherboard Tinning, Soldering, Desoldering and 3D BGA Reballing

• Compatibility: iPhone 16, 16 Plus, 16 Pro and 16 Pro Max

• Stencil Thickness: 0.12 mm

• Platform Material: High-Temperature-Resistant Synthetic Stone

• Stencil Material: Steel Mesh

• Stencil Design: Precision Square and Round Openings

• Key Benefits: Precise Alignment, Easy Cleaning and Reduced Solder Ball Jamming