RELIFE RL-601T Middle Board Tinning Platform Kit – iPhone 15 Series

The RELIFE RL-601T Middle Board Tinning Platform Kit is a specialized repair tool designed for smartphone motherboard middle-layer tinning, soldering, desoldering, and 3D BGA reballing. It helps mobile phone technicians perform precise motherboard repair tasks with improved alignment and accuracy.

Featuring a high-temperature-resistant synthetic stone platform and a precision steel stencil, this kit is designed to support detailed soldering work while helping reduce solder ball jamming. The iPhone 15 Series version is intended for motherboard repair applications involving the iPhone 15, iPhone 15 Plus, iPhone 15 Pro, and iPhone 15 Pro Max.

Specifications

• Brand: RELIFE

• Model: RL-601T

• Product Type: Middle Board Tinning Platform Kit

• Compatibility: iPhone 15, 15 Plus, 15 Pro and 15 Pro Max

• Application: Motherboard Tinning, Soldering, Desoldering and 3D BGA Reballing

• Stencil Thickness: 0.12 mm

• Platform Material: High-Temperature-Resistant Synthetic Stone

• Stencil Material: Steel Mesh

• Stencil Openings: Square and Round

• Key Benefits: Precise Alignment, Easy Cleaning and Reduced Solder Ball Jamming